wiring board

英 [ˈwaɪərɪŋ bɔːd] 美 [ˈwaɪərɪŋ bɔːrd]

插接板

计算机



双语例句

  1. It includes wiring of printed circuit board, electric capacity coupling, tolerance of digital circuit noise, and transmission line.
    其中包括对印制板的布线、电容性耦合、数字电路的噪声容限和传输线的探讨。
  2. The surface of the support board is perpendicular to the ground, and the wiring surface of the socket is in parallel with the surface of the support board.
    支撑板的板面与地面垂直并且插座的接线面与所述支撑板的板面平行。
  3. On this case through the completion of manual wiring circuit board design.
    本例讲解了通过手工布线完成电路板的设计。
  4. A Method of the General Anlysis of Automatic Wiring on a Two-Layer Printed-Circuit Board
    双层印制板自动布线总体分析方法
  5. In view of the complicated structure and limited wiring space of airborne electronic apparatus, a novel cabling board wiring design method is proposed to make the wiring technology design better meet the requirement for compact assembling, reliable connection and easy maintenance of airborne electronic apparatus.
    针对结构复杂、布线空间受局限的机载电子整机,从工艺角度提出了一种新颖的布线板布线设计方法,使布线工艺更能适应机载电子整机连接紧凑、可靠、维修方便的要求。
  6. Printed Wiring Board Manufacturing Technology Trends
    高密度封装进展之四&印制线路板制造技术的发展趋势
  7. Current Condition of Build-up Multilayer Wiring Board in Application Market
    积层多层板应用市场的现状
  8. The Questions in Designing Printed Wiring Board and the Solutions
    设计印制线路板应注意问题及解决方法
  9. Advanced packaging technology represented by CSP and the development of build up-type multilayer printed wiring board ( PWB) that make such high-density packaging possible are making greatly progress.
    以CSP为代表的先进封装技术和可以实现高密度封装的确积层多层板的开发已经取得了很大的进步。
  10. Automatic Routing for the Wiring of Multilayer Printed Circuit Board DBX 2
    多层印制底板自动布线系统DBX2
  11. Oilpaper capacity type wall bushing can be divided into two types of vertical and horizontal, which is totally sealed and covered with major components such as oil pillow, porcelain bushing, capacity core, connection sleeve and wiring board.
    油纸电容式穿墙套管分为立式和卧式两种,均为全密封结构,主要由油枕、瓷套、电容芯子、连接套筒、接线板等零部件组成。
  12. Extraction of gold from printed wiring board solution with polyethylene glycol-ammonium sulphate aqueous two-phase system
    聚乙二醇-硫酸铵双水相萃取废弃印刷线路板处理液中的金
  13. This paper described the principles of the components distributing and numbering, the principles of making the size, aperture, land and printed wiring certain in the design of printed circuit board. It may help technicians to make perfect design for engineering.
    详细阐述了印制电路板设计中的元器件分布,编号原则以及印制电路板尺寸、孔、连接盘、线的确定原则,可为技术人员进行完善的工程设计提供帮助。
  14. Study on Anticorrosion quality of printed wiring board assembly of oceanographical instruments by salt-mist test
    用盐雾试验检验海洋仪器装配板耐腐蚀性能的研究
  15. As a microwave material of new type, it is widely used in making electrical components of microwave wiring board for all kinds of needs.
    作为一种新型微波材料,广泛用于制作各种需要微波线路板的电器元件。
  16. Using these characteristics, the paper designed the Chebyshev low-pass filter, the Biquadratic Elliptic function high-pass filter and manufactured the printing wiring board.
    利用这一特点,设计了性价比优越的切比雪夫有源低通滤波器和双二次型椭圆函数有源高通滤波器,并制作了印刷电路板。
  17. Copper Foil for the High Density and Super Fine Pattern Printed Wiring Board
    高密度超精细线路印制板用铜箔
  18. This paper analyses some details in different phases of designing printed wiring board and correct designing steps also introduces some possible questions of laying lines, various noises and the solutions.
    分析在印制线路板设计各个阶段中应注意的细节和正确的设计步骤,给出可能遇到的布线问题,噪声种类及其解决方法。
  19. Automatic wiring system of printed circuit board
    印刷电路板自动布线系统
  20. Integrated Package Technique of Multilayer Wiring on Silicon Based Board
    硅基多层布线集成组装技术
  21. Impedance Controlling Printed Wiring Board Design Technology for High Frequency Electronic Machine
    适用于高频电子机器的阻抗控制印制线路板设计技术
  22. Server can also receive control commands through the monitor cabinet controlled internal wiring board, the load on the failure to make timely processing power.
    也能够接收服务器发出的控制指令,通过机柜监控器内部的受控接线板,对出现故障的负载及时做出断电处理。
  23. Besides, the appropriate grounding, filtering, wiring of circuit board, IC decoupling capacitor and other measures have been taken to improve product performance against interference and electromagnetic compatibility.
    并采取了适当的接地,滤波,电路板布线,IC去耦等措施来改善产品的抗干扰性能及电磁兼容性能。